ARK | Intel(R) NUC Kit DC3217BY Menu Communities Find Content Search Intel.com Search Type Here to Search Products ARK Home Send Feedback Twitter Facebook Submit Query LinkedIn Intel(R) NUC Kit DC3217BY Add to Compare SPECIFICATIONS SPECIFICATIONS Essentials Memory Specifications Graphics Specifications Expansion Options I/O Specifications Package Specifications Advanced Technologies Intel(R) Platform Protection Technology PRODUCT IMAGES ORDERING / SSPECS / STEPPINGS RELATED PRODUCTS - Essentials Intel(R) NUC Boards and Kits Status Launched Launch Date Q4'12 Board Form Factor UCFF Embedded Options Available No DC Input Voltage Supported 19V Recommended Customer Price Intel(R) NUC Kits Mobile Intel(R) QS77 Express Chipset QUICK LINKS No Datasheet Available Export Full Specifications Description Link Processor Included Core i3-3217U Search Distributors Software Downloads Support Overview Search all of intel.com - Memory Specifications Max Memory Size (dependent on memory type) 16 GB Memory Types DDR3-1333/1600 # of DIMMs 2 PCN/MDDS INFORMATION 923299: PCN - Graphics Specifications Integrated Graphics Yes Graphics Output # of Displays Supported HDMI Thunderbolt 2 - Expansion Options PCIe Mini Card Slot (Half Length) 1 PCIe Mini Card Slot (Full Length) 1 - I/O Specifications USB Revision Newsroom # of USB Ports Chip Shot: New Intel(R) Xeon(R) Processor Powers Real-Time Analytics USB 2.0 Configuration (Back + Internal) 2.0 3 30 - Package Specifications Low Halogen Options Available See MDDS - Advanced Technologies Intel(R) HD Audio Technology - Intel(R) Platform Protection Technology http://ark.intel.com/products/71274/Intel-NUC-Kit-DC3217BY[2/20/2014 4:49:24 PM] Yes USA (English) ARK | Intel(R) NUC Kit DC3217BY Anti-Theft Technology Yes All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. "Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Send us your feedback! http://ark.intel.com/products/71274/Intel-NUC-Kit-DC3217BY[2/20/2014 4:49:24 PM]